Deca and SST form a partnership to drive storage technology through innovative NVM chiplet solutions to increase efficiency, scalability and semiconductor innovation.

Deca Technologies and Microchip subsidiary Silicon Storage Technology (SST) have teamed up to produce a state-of-the-art non-volatile memory (NVM) chiplet package. The initiative is aimed at transforming how semiconductor designs are done to make it easier to integrate and advance the storage technology solutions.

The combination of Deca's M-Series fan-out and Adaptive Patterning and SST's proven SuperFlash embedded storage technology makes a fantastic collaboration. Together, they hope to be able to offer large-scale, flexible storage technology integration for multi-die semiconductor systems. By taking advantage of the benefits of modular chiplet designs, the solution promises an increase in efficiency, lower costs and products that can quickly adapt to new projects.

This partnership focuses on a modular and memory-centric approach for future architectures, which have an advantage over the traditional monolithic architectures. Deca will contribute its know-how of redistribution layer design, tests and manufacturing workflows, and SST has the know-how of integrating the core flash technology into self-contained chiplets.

Experts in the industry believe that this step will speed up the use of different types of chip integration and chiplet advancements, which will help spread advanced storage technology around the world. The companies highlighted the fact that such customers will be benefited with reduced design timelines and better scalability and scope of freedom in semiconductor development.

As chiplet-based solutions pick up steam, the Deca-SST collaboration is poised to lead the way in innovation, efficiency and market competitiveness in storage technology for years to come.