Telink’s Low-power, secure chips set to transform smart homes, wearables, and asset tracking

Telink Semiconductor launched its ML7218A, ML7218D, and ML3219D wireless modules, bringing cutting-edge, low-power solutions to India’s booming IoT market. These modules, designed for smart homes, wearables, and asset tracking, promise to redefine connectivity with high performance, robust security, and energy efficiency, as reported by Electronic News.

The ML7218A and ML7218D, powered by 32-bit RISC-V MCUs with up to 240 MHz clock speeds, boast 512KB SRAM and 2MB flash memory, ideal for complex tasks. Supporting Bluetooth LE, Zigbee, Thread, and proprietary 2.4GHz protocols, they ensure seamless IoT integration. Their deep sleep mode consumes just 1µA, extending battery life for devices like smart locks and fitness trackers. Security features include secure boot, firmware encryption, and hardware-accelerated AES and ECC.

The ML3219D, a multi-protocol module, supports Bluetooth LE, Zigbee, Matter, and Thread, with 128KB SRAM and 2MB flash. Its advanced interfaces, including USB and audio processing, cater to diverse applications like smart sensors and industrial automation. All modules carry global certifications like FCC, CE, and PSA1, ensuring reliability.

Telink’s AIOT-DK1-V2 development kit and universal SDK, supporting features like Matter and low-latency audio, empower developers to fast-track projects. With India’s IoT market growing, these modules position Telink to drive innovation in smart living and industrial solutions.